MCM
full spelling ： Multi Chip Module
Multi Chip Module or MCM is an electronic chip packaging module where multiple integrated circuits (ICs), semiconductor dies or other modules are packaged in such a way as to facilitate their use as a single IC.
Multi Chip Modules are classified according to the technology used to create the High Density Interconnection substrate. They are classified as laminated MCM (MCM-L), deposited MCM (MCM-D) and ceramic substrate MCM (MCM-C). In MCM-L the substrate is a multi-layer laminated printed circuit board and in MCM-D the modules are deposited on the base substrate using thin film technology.